- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
Patent holdings for IPC class H01L 23/473
Total number of patents in this class: 2818
10-year publication summary
|
207
|
279
|
244
|
257
|
244
|
292
|
221
|
231
|
241
|
104
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 4750 |
116 |
| International Business Machines Corporation | 60644 |
109 |
| Mitsubishi Electric Corporation | 43934 |
102 |
| Denso Corporation | 23338 |
97 |
| Intel Corporation | 45621 |
91 |
| Hitachi Astemo, Ltd. | 5618 |
59 |
| Toyota Motor Corporation | 28582 |
57 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
41 |
| Fujitsu Limited | 19265 |
40 |
| Siemens AG | 24990 |
38 |
| Mitsubishi Materials Corporation | 2378 |
37 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION) | 13301 |
37 |
| Raytheon Company | 8535 |
28 |
| Robert Bosch GmbH | 40953 |
26 |
| Nidec Corporation | 2579 |
26 |
| Infineon Technologies AG | 8189 |
25 |
| Hewlett Packard Enterprise Development LP | 10702 |
24 |
| Cooler Master Co., Ltd. | 191 |
23 |
| Nippon Light Metal Company, Ltd. | 645 |
22 |
| Kyocera Corporation | 12735 |
21 |
| Other owners | 1799 |